Please use this identifier to cite or link to this item: http://cris.utm.md/handle/5014/704
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dc.contributor.authorSUDACEVSCHI, Vioricaen_US
dc.contributor.authorABABII, Victoren_US
dc.date.accessioned2021-01-29T13:48:17Z-
dc.date.available2021-01-29T13:48:17Z-
dc.date.issued2020-05-
dc.identifier.citationS. Viorica and A. Victor, "Multidimensional Digital Signal Processing for Printed Circuit Boards Testing," 2020 International Conference on Development and Application Systems (DAS), Suceava, Romania, 2020, pp. 60-63, doi: 10.1109/DAS49615.2020.9108971.en_US
dc.identifier.urihttp://cris.utm.md/handle/5014/704-
dc.description.abstractA new method for multidimensional digital signal processing for Printed Circuit Boards (PCB) testing is described. The considered method comes to solve such problems as competition and synchronization, which are present in the multidimensional signals processing. The solution is achieved by performing in parallel all operations, replacing the analog-to-digital conversion (ADC) with differentiation operations and analyzing the signal variation rate based on the Fuzzy logic elements. As a result of these operations, using digital integration models, binary code streams are obtained that allow the reconstruction of the signal shape. Mathematical models applied for the transformation and processing of multidimensional signals are presented. The designed system for the multidimensional signal processing consists of a computing unit, the test signals generator, the data storage unit, the Printed Circuit Board with nodes for test signals application and retrieval, and finally the processing elements for differentiation and analysis based on Fuzzy logic.en_US
dc.language.isoenen_US
dc.relation.ispartof2020 International Conference on Development and Application Systems (DAS)en_US
dc.subjectmultidimensional signalen_US
dc.subjectdigital signal processingen_US
dc.subjectPCBs testingen_US
dc.subjectFuzzy logicen_US
dc.subjectFPGAen_US
dc.subjectADCen_US
dc.titleMultidimensional Digital Signal Processing for Printed Circuit Boards Testingen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/DAS49615.2020.9108971-
item.fulltextWith Fulltext-
item.languageiso639-1other-
item.grantfulltextopen-
crisitem.author.deptDepartment of Computer Science and Systems Engineering-
crisitem.author.deptDepartment of Computer Science and Systems Engineering-
crisitem.author.orcid0000-0002-0769-8144-
crisitem.author.parentorgFaculty of Computers, Informatics and Microelectronics-
crisitem.author.parentorgFaculty of Computers, Informatics and Microelectronics-
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